Ultra-clean. Low-particle.
Fab-ready.
ISO 8 handling.
Wafer handling fixtures, vacuum chamber components, process chamber shields, EMI enclosures. Semiconductor-grade aluminum, passivated 316L, electroless nickel plating. ISO 8 cleaning and double-bagged packaging standard.
Semiconductor part families.
Wafer handling fixtures
End-effector tips, wafer tweezers, cassette hardware. Static-dissipative PEEK or anodized aluminum.
Process chamber shields
Sacrificial liners, shield cans, deposition shields. Particle-optimized surface finish, hard-anodized.
Vacuum chamber bodies
UHV-compatible chamber shells, conflat flange machining, port hardware. Polished to Ra 0.4 µm.
Gas distribution plates
Shower-head assemblies, gas diffusers with precision-drilled small-diameter holes. Low-particle finish.
E-chuck / pedestal bodies
Machined aluminum bodies for electrostatic chucks. Ceramic top surfaces through partner.
EMI shielded enclosures
Faraday-cage construction for RF-sensitive equipment. Conductive gasketing, continuous seam bonding.
Test socket hardware
Socket pins, probe card hardware, burn-in board components. High-temperature capable.
Robot arm components
End-effectors, arm links, mounting brackets for wafer-handling robots.
Lithography tool parts
Precision-machined aluminum, Invar, or ceramic frames for step-and-repeat and scanner hardware.