Skip to main content
Molybdenum · Mo · TZM

High-temperature refractory.
Semiconductor furnace.
1800 °C service.

Molybdenum serves where refractory metals are required — 1800 °C continuous service, low thermal expansion matching semiconductor materials, low activation for nuclear applications. Standard for semiconductor furnace hardware, glass melting electrodes, aerospace hot section.

01 · Grades & variants

Molybdenum variants.

Pure Mo for basic applications, TZM alloy for improved strength at temperature, Mo-Cu composite for semiconductor heat spreaders.

Pure Molybdenum

99.95% Mo

Commercially pure molybdenum. Standard refractory grade for furnace components, glass melting electrodes.

TZM Alloy

Ti-Zr · stronger

Mo with 0.5% Ti, 0.08% Zr. Higher strength at temperature than pure Mo. Aerospace hot section, forged tooling.

Mo-Cu Composite

Heat spreader

Molybdenum matrix infiltrated with copper. CTE matches silicon and GaAs. Used for semiconductor heat spreaders, IC packaging.

Mo-Re Alloy

Ductile · high-temp

Molybdenum with rhenium for ductility. Used for thermocouple wire, nuclear applications.

Mo-La Alloy

La2O3 · creep

Lanthanum oxide dispersed in Mo. Better creep resistance at high temperature. Used for glass industry, lighting filaments.

Mo Sheet

Thin gauge

Rolled Mo sheet in thicknesses from 0.1 mm to 10 mm. Standard form for furnace shields, reflectors.

02 · Why this material

Why molybdenum.

Molybdenum occupies a niche: higher temperature than steel, lower cost than tungsten or tantalum, well-understood refractory metal.

High temperature

1800 °C continuous service — far beyond any steel or superalloy. Glass melting, semiconductor furnace, vacuum furnace hot zones.

Low thermal expansion

5.5 ppm/°C matches sapphire and silicon. Used for semiconductor packaging where CTE mismatch causes failures.

High thermal conductivity

138 W/m·K — 3× typical steel. Makes Mo-Cu heat spreaders effective for high-power semiconductors.

Low neutron cross-section

Nuclear applications — Mo is used where low neutron absorption matters (reactor structural, waste handling).

03 · Applications

Molybdenum applications.

Semiconductor furnace

Silicon crystal growth hot zones, shields, susceptors — standard material for semiconductor fab equipment

Glass melting electrodes

Direct electrode heating of molten glass in specialty glass manufacturing

Vacuum furnace components

Hot zone structural components, radiation shields, support hardware

Sapphire growth

Crucibles for sapphire crystal growth for LEDs and watch glass

Aerospace hot section

Rocket engine components, hot structural parts in hypersonic applications

Semiconductor heat spreaders

Mo-Cu composite for high-power IC thermal management

Lighting filaments

High-temperature lighting filament hardware

X-ray anode

X-ray tube anode material for medical and industrial X-ray equipment

Nuclear fuel cladding

Specialty nuclear fuel cladding applications — low neutron absorption

04 · Finishing

Molybdenum finishing.

As-machined

Silver-grey. Brittle in air at room temperature — careful handling. Ra 1.6 µm typical.

Ground

Precision grinding for tight tolerances on Mo components.

Stress relief

Post-machining stress relief at 1200-1300 °C in hydrogen or vacuum reduces residual stress, prevents brittle fracture.

Vacuum cleaned

Ultrasonic + vacuum cleaning for semiconductor applications — zero contamination critical.

Welded

Electron beam or TIG welding in ultra-dry inert atmosphere. Mo absorbs oxygen catastrophically above 400 °C in air.

Brazed

Brazing in vacuum with nickel or copper-silver filler. Standard for joining Mo to dissimilar metals.

Polished

Mirror finish achievable. Used for radiation reflectors and optical-grade applications.

Coated

Silicide or aluminide coatings protect Mo from oxidation during use above 500 °C in air.

FAQ

Molybdenum questions.

Molybdenum forms volatile MoO3 above 500 °C in oxidizing atmosphere — the oxide sublimes away, exposing fresh metal, which oxidizes further. Catastrophic loss of material. In vacuum or inert atmosphere, Mo is stable to 1800 °C+. In reducing atmosphere (hydrogen), similar. For Mo service above 500 °C in air: oxidation-resistant coating required (silicide, aluminide), or switch to oxidation-resistant refractory (e.g., niobium alloys).
Pure Mo: 550 MPa strength at room temperature, 200 MPa at 1000 °C. Standard for shields, structural in vacuum. TZM alloy: 900 MPa at room temp, 500 MPa at 1000 °C. Better creep resistance. Used where Mo must maintain strength at temperature. TZM is premium cost (roughly 2× pure Mo) — justify only when elevated-temperature strength is needed.
Pure Mo is brittle at room temperature — can crack from over-aggressive machining. Sharp tools, light cuts, moderate speeds. TZM is slightly tougher but similar. Use carbide tooling, flood coolant, climb milling. Avoid sharp notches in design (stress concentrators). Plan for slightly longer machining time vs steel. Our experience includes Mo furnace components for semiconductor industry.
Molybdenum matrix infiltrated with copper. Balances thermal conductivity (from Cu) with low thermal expansion (from Mo). CTE can be tuned from 5-12 ppm/°C by adjusting Cu content. Matches silicon (3 ppm/°C), GaAs (6 ppm/°C), and ceramic packaging materials. Critical for high-power RF electronics, laser diode mounts, power transistor thermal management. Standard product form for semiconductor packaging.
Pure Mo raw material: $50-100/kg. TZM: $80-150/kg. Mo-Cu: $100-200/kg. Machining similar cost to steel. Finishing (grinding, stress relief) adds cost. Typical finished Mo parts: 3-5× cost of equivalent steel parts. For applications where Mo's unique properties are needed, cost is justified by enabling the application.
Pure Mo: 3-4 weeks for standard bar stock sizes. TZM: 4-6 weeks. Mo-Cu composites: 6-8 weeks. Sheet Mo: 2-3 weeks for standard thicknesses. Custom sizes: add 2-4 weeks. With stress relief or coating: add 1-2 weeks. Plan 6-10 weeks for typical Mo project lead time.
Ready When You Are

Upload a CAD file.
Get an engineering-reviewed quote in under 24 hours.

No minimum quantity. Free DFM feedback from a senior manufacturing engineer. NDA signed before file review on request.

Start an Instant Quote Talk to an Engineer
Avg. response · 4h · Mon–Sat (GMT+8)
Industries we serve
Trusted across 12 verticals worldwide