Custom fin geometry.
Pin fin arrays.
Liquid cold plates.
CNC machined heat sinks and thermal management hardware for custom applications. Custom fin patterns, pin fin arrays, liquid cold plates, embedded heat pipes. 6063 aluminum, OFE copper, Mo-Cu composites. LED drivers, lasers, power electronics, CPU thermal.
Heat sink types we build.
Different thermal challenges call for different heat sink architectures. Here's what we build most often.
Extruded-profile finned
Standard extruded aluminum profiles cut and machined to length. Added features: mounting holes, precision flatness.
CNC-milled fin arrays
Fully CNC-machined fin geometry. Custom spacing, orientation, non-uniform patterns for optimized heat transfer.
Pin fin arrays
Pin fin geometry maximizes surface area per volume. Used for high-density thermal management.
Liquid cold plates
Cold plates with internal serpentine liquid channels. Machined base + brazed cover for leak-tight liquid cooling.
Cross-cut fin
Crossed-fin patterns for omnidirectional airflow — used when airflow direction varies.
Heat spreaders
Thermal interface hardware matching CTE to semiconductor. Mo-Cu for silicon/GaAs matching.
Heat pipe integrated
Heat sinks with embedded heat pipes for spreading heat from point sources.
LED heat sinks
High-volume LED luminaire heat sinks. Optimized for thermal + manufacturing cost.
Cryogenic cold plates
Cryogenic cold plates for liquid nitrogen or helium cooling. OFE copper for thermal conductivity at cryogenic temperature.
Thermal customers we serve.
Power electronics
IGBT baseplates, traction inverter heat sinks, server power supply thermal
Laser manufacturers
Laser diode heat sinks, laser cavity cooling, high-power laser thermal management
LED luminaires
Industrial and commercial LED thermal — outdoor, indoor, street lighting
CPU/GPU cooling
High-performance computing and server rack cooling hardware
Automotive electronics
EV motor controller, on-board charger thermal management
Medical imaging
MRI gradient amplifier cooling, X-ray tube thermal management
Aerospace electronics
Avionics and satellite electronics thermal management
Telecom infrastructure
5G base station thermal, network switch cooling
Research equipment
Scientific instrument thermal management, laser laboratory hardware
Heat Sinks questions.
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